EMRA33P2J-25.000M TR

EMRA33P2J-25.000M TR REGULATORY COMPLIANCE (Data Sheet downloaded on Jan 9, 2020) 2011/65 + 2015/863 191 SVHC ITEM DESCRIPTION MEMS Clock Oscillators LVCMOS (CMOS) 3.3Vdc 4 Pad 2.5mm x 3.2mm Plastic Surface Mount (SMD) 25.000MHz ±50ppm over -40°C to +105°C ELECTRICAL SPECIFICATIONS Nominal Frequency 25.000MHz Frequency Tolerance/Stability ±50ppm Maximum over -40°C to +105°C (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability over the Operating Temperature Range, Supply Voltage Change, and Output Load Change) Aging at 25°C ±1.5ppm Maximum First Year Supply Voltage 3.3Vdc ±10% Input Current 6mA Maximum (No Load) Output Voltage Logic High (Voh) 90% of Vdd Minimum (IOH = -4mA) Output Voltage Logic Low (Vol) 10% of Vdd Maximum (IOL = +4mA) Rise/Fall Time 1.2nSec Typical, 3nSec Maximum (Measured from 20% to 80% of waveform) Duty Cycle 50 ±5(%) (Measured at 50% of waveform) Load Drive Capability 15pF Maximum Output Logic Type CMOS Output Control Function Power Down (Disabled Output: Logic Low) Output Control Input Voltage Logic High (Vih) 70% of Vdd Minimum or No Connect to Enable Output Output Control Input Voltage Logic Low (Vil) 30% of Vdd Maximum to Disable Output Power Down Output Enable Time 5mSec Maximum Power Down Output Disable Time 150nSec Maximum Standby Current 10µA Maximum Period Jitter (RMS) 2pSec Typical, 4pSec Maximum RMS Phase Jitter (Fj = 900kHz to 7.5MHz; Random) 0.5pSec Typical, 1pSec Maximum RMS Phase Jitter (Fj = 12kHz to 20MHz; Random) 1.5pSec Typical, 3pSec Maximum Start Up Time 5mSec Maximum Storage Temperature Range -65°C to +150°C ENVIRONMENTAL & MECHANICAL SPECIFICATIONS ESD Susceptibility JESD22-A114, HBM, 2000V Flammability UL94-V0 Mechanical Shock MIL-STD-883, Method 2002, Condition E, 10,000G Moisture Sensitivity J-STD-020, MSL 1 Solderability MIL-STD-883, Method 2003 (Four I/O Pads on bottom of package only) Temperature Cycling JESD22-A104, Condition B Vibration MIL-STD-883, Method 2007, Condition A, 20G www.ecliptek.com | Specification Subject to Change Without Notice | Revision C 03/31/2014 | Page 1 of 7 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 EMRA33P2J-25.000M TR MECHANICAL DIMENSIONS (all dimensions in millimeters) 2.50 ±0.10 0.75 ±0.10 0.70 ±0.10 (x4) 4 3.20 ±0.10 1 PIN CONNECTION 1 Power Down (Logic Low) 2 Ground 3 Output 4 Supply Voltage LINE MARKING 1 2.10 ±0.10 3 2 Ecliptek Manufacturing Identifier 0.90 ±0.10 (x4) 0.90 ±0.15 Suggested Solder Pad Layout All Dimensions in Millimeters 1.20 (X4) 1.40 (X4) Solder Land (X4) 0.80 0.70 All Tolerances are ±0.1 www.ecliptek.com | Specification Subject to Change Without Notice | Revision C 03/31/2014 | Page 2 of 7 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 EMRA33P2J-25.000M TR CLOCK OUTPUT POWER DOWN INPUT OUTPUT WAVEFORM & TIMING DIAGRAM VIH VIL VOH 80% of Waveform OUTPUT DISABLE (LOGIC LOW) 50% of Waveform 20% of Waveform VOL tPLZ Fall Time Rise Time tPZL TW T Duty Cycle (%) = TW/T x 100 www.ecliptek.com | Specification Subject to Change Without Notice | Revision C 03/31/2014 | Page 3 of 7 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 EMRA33P2J-25.000M TR Test Circuit for CMOS Output Oscilloscope + + Power Supply _ Current Meter _ Supply Voltage (VDD) Frequency Counter Probe (Note 2) Output + Voltage Meter _ 0.01µF (Note 1) 0.1µF (Note 1) Ground CL (Note 3) Tri-State or Power Down Note 1: An external 0.01µF ceramic bypass capacitor in parallel with a 0.1µF high frequency ceramic bypass capacitor close (less than 2mm) to the package ground and supply voltage pin is required. Note 2: A low input capacitance (10Mohms), and High bandwidth (>300MHz) passive probe is recommended. Note 3: Capacitance value CL includes sum of all probe and fixture capacitance. See applicable specification sheet for ‘Load Drive Capability’. www.ecliptek.com | Specification Subject to Change Without Notice | Revision C 03/31/2014 | Page 4 of 7 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 PART NUMBER DATA SHEET EMRA33P2J-25.000M TR Tape & Reel Dimensions Quantity Per Reel: 1,000 units All Dimensions in Millimeters Compliant to EIA-481 4.00 ±0.10 0.60 MAX DIA 1.50 +0.10/-0.00 0.10 MAX 2.00 ±0.05 1.75 ±0.10 3.50 ±0.05 MARKING ORIENTATION 8.00 ±0.30 DIA 1.00 MIN 4.00 ±0.10 B0 A0 K0 Direction of Unreeling 1.50 MIN 14.40 MAX DIA 40 MIN Access Hole at Slot Location 180 MAX DIA 50 MIN DIA 20.20 MIN DIA 13.00 ±0.20 2.50 MIN Width 10 MIN Depth Tape slot in Core for Tape Start 8.40 +1.50/-0.00 www.ecliptek.com | Specification Subject to Change Without Notice | Revision C 03/31/2014 | Page 5 of 7 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 EMRA33P2J-25.000M TR Recommended Solder Reflow Methods High Temperature Infrared/Convection TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5°C of actual peak (tp) Ramp-down Rate Time 25°C to Peak Temperature (t) Moisture Sensitivity Level Additional Notes 3°C/Second Maximum 150°C 175°C 200°C 60 - 180 Seconds 3°C/Second Maximum 217°C 60 - 150 Seconds 260°C Maximum for 10 Seconds Maximum 250°C +0/-5°C 20 - 40 Seconds 6°C/Second Maximum 8 Minutes Maximum Level 1 Temperature shown are applied to body of device. www.ecliptek.com | Specification Subject to Change Without Notice | Revision C 03/31/2014 | Page 6 of 7 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 EMRA33P2J-25.000M TR Recommended Solder Reflow Methods Low Temperature Infrared/Convection 240°C TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5°C of actual peak (tp) Ramp-down Rate Time 25°C to Peak Temperature (t) Moisture Sensitivity Level Additional Notes 5°C/Second Maximum N/A 150°C N/A 60 - 120 Seconds 5°C/Second Maximum 150°C 200 Seconds Maximum 240°C Maximum 240°C Maximum 2 Times / 230°C Maximum 1 Time 10 Seconds Maximum 2 Times / 80 Seconds Maximum 1 Time 5°C/Second Maximum N/A Level 1 Temperature shown are applied to body of device. Low Temperature Manual Soldering 185°C Maximum for 10 Seconds Maximum, 2 times Maximum. (Temperature shown are applied to body of device.) High Temperature Manual Soldering 260°C Maximum for 5 Seconds Maximum, 2 times Maximum. (Temperature shown are applied to body of device.) www.ecliptek.com | Specification Subject to Change Without Notice | Revision C 03/31/2014 | Page 7 of 7 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200